Important Update 1: Due to COVID-19, AsiaHaptics 2020 will be postponed untill November, 2022. This was a hard decision to make, but for AsiaHaptics, which has a unique signature of haptic-oriented demonstrations with special emphasis on try-on experience, we have to do so. Thank you for your understanding.
Important Update 2: Although the main conference is re-scheduled, a special online workshop is organized in November, this year.
▪The tentative time for the workshop is Nov. 9, 2020, 8pm-11pm, Beijing time, which will be 7-10am in Chicago and 1-4pm in London.
▪The workshop will be about 3 hours long, with 3 invited keynote speakers. We are very glad to have Prof. Ed Colgate from Northwestern University, Prof. Etienne Burdet from Imperial College London, and Prof. Masahiko Inami from The University of Tokyo to deliver the keynote talks.
▪3-5 selected Student Innovation Challenge teams to present their work using online video demonstration.
▪Virtual lab tours will also be provided by some professors from the AsiaHaptics Steering Committee. The detailed agenda of the workshop will be announced later.
AsiaHaptics is a young international conference about haptics, emphasizing interactive presentations with demos. Following the three successful events in 2014 Tsukuba, 2016 Kashiwanoha, Japan and 2018 Incheon, Korea, the fourth AsiaHaptics will take place in Beijing, China.
Eligible topics include, but not limited to:
▪Kinesthetic interfaces ▪Tactile displays ▪Haptic rendering and modeling ▪Sensors and actuators
▪Shared control and collaboration ▪Teleoperation ▪ Human-computer interaction
▪Physical human-robot interaction ▪Virtual and augmented reality ▪ Multi-modal systems
▪ Human perception and neuroscience of touch ▪ Innovative applications of haptics
Type of Contributions:
Live Demo : Live presentation with demo(submission: short paper and video)
Video Demo : Presentation with video(submission: extended abstract and video)
Workshop/Tutorial : One-day or Half-day topical meetings(submission: proposal)
▪ Keynote ▪ Industrial Session ▪ Technical Tour ▪ Cultural Tour ▪ Student Innovation Challenge